Wafer Probe Cards

TSE provides production proven, highly parallel wafer probe cards for FLASH and MCP for single touch down on 200mm and 300mm wafers.

Module Design - Parallel Assembly Process - Fast Delivery

  • New tester platform : 10 weeks
  • New device model : 5 weeks
  • Repeat : 3 weeks

Cantilever Probe – Proven Technology

  • Probes are assembled by machine; currently up to 23,000 per card max.
  • Max. two layer probe assembly structure – force & scrub uniformity
  • Large Probing Area: 12” single touch-down

Multi-Piece Stiffener – Minimize Temperature Deformation

  • Hot & Cold with one probe card (pad size 60um x 70um)

Machine-Assembled Probes

Machine-Assembled Probes

Typical Specification

1TD 12-inch NAND Flash CPC

  • Tester: Yokogawa/Advantest
  • PCB diameter: Ø440mm, Ø480mm
  • Touch down: 12” 1 touch down
  • PA size: 300mm X 300mm
  • Min. pad size: 75um X 75um (Hot only) 60um X 70um (Hot & Cold)
  • Probe force: 1.5g/mil
  • Max scrub mark: 25um @O.D 100um
  • Alignment: ±12um
  • planarity: 22um (max-min)
  • Tip shape: flat circle, semi radius
  • Tip size: 18±3um
  • Max current: 500mA (continous)

Shipments to Date

Touch-Down Process Quantity Total
8” 2 Shot Test and WBI 54 487
8″ 1 Shot Test and WBI 90
12″ 2 Shot Test and WBI 123
12″ 1 Shot Test and WBI 120

Product Development

Product Development Timeline

Lead Time Analysis

Lead Time Analysis

Tip Cleaning Process

  • TSE Recommended Process – On-line cleaning at probe system
  • Cleaning Period – 100~500 touchdown, depend on wafer condition, AL pad wafer + Tungsten probe

Tip Cleaning Process

Metrology Systems

  1. API ProbeWoRx: 3 Systems
  2. Mother Boards: 9 Sets ( 480mm TEST 2, 480mm WBI 2, 440 TEST 2, etc)
  3. 3D Laser Inspection System: 6 Systems
  4. VNE Network Analyzer & Probe Station (UF-3000) : 1 set

Metrology Systems

New Probe Card Factory

New Factory for Probe Cards

  1. Floor Space: 161,000 sq. ft.
  2. Clean Room: 9000 sq. ft.